Used for automatic and laser marking of scrap units on carrier products, which facilitates efficient and accurate identification of subsequent processes, and improves the product yield and process efficiency of customer factories.
Double-station operation to realize high-speed processing of bad board marks on IC substrate
Configure energy monitoring system to ensure the stability of product processing effect
It can automatically identify the front end process mark, or connect to the customer system to directly obtain the location information of the scrap board for marking
The piracy mechanism realizes double-sided processing of the product, no adjustment is required when changing materials, which improves production efficiency and ease of use
ITEM
MAIN TECHNICAL PARAMETERS
Laser system
Laser type
Green laser 532nm
Average output power
10W
Field lens scanning range
150x150mm
Main configuration
Working platform
Dual linear motor platform
Vision system
Industrial CCD positioning and code reading system
Condition monitoring
Laser energy monitoring system
Automatic loading and unloading system
Loading and unloading drawer, vacuum adsorption system
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