Cutter Wheel Cutting Machine
This equipment is mainly developed for semiconductor and 3C industries. Suitable for cutting silicon, ceramics, glass, SiC and other materials. It has the advantages of fast cutting speed and high positioning accuracy. The equipment is equipped with a high-precision CCD vision system, which can realize the automatic positioning and angle adjustment of the workpiece and improve the processing efficiency.

Product Data

Product advantages:

 

  • Small size

           The appearance size and the floor area are small, and the cutting stroke is large.

  • High efficiency

          High power spindle, high-speed and high-precision motor, closed-loop motion control to ensure production efficiency.

  • Complete detection

          Equipped with NCS, knife mark, edge collapse and cutting path position detection function

  • Fullly featured

          It is equipped with data management, alarm recording and log management functions.

 

Applications:

  • Semiconductor industry
  • 3C industry

 

Sample display:

Cutting of plyglass; thickness: 2.5mm

laser cutting of plyglas

laser cutter

Item

Main Parameters

Working table size

Circular working table

Ø6″

X axis

Available track

235mm

Cutting stroke

0.1—800mm/s

Y axis

Available track

145 mm

Stroke resolution

0.0005mm

Repetitive positioning accuracy

0.001mm

T axis

Angle range

335°deg

Repetitive positioning accuracy

0.001°

Function

Automatic positioning of workpiece

Standard configuration

Automatic alignment of workpiece

Standard configuration

NCS height measurement

Standard configuration

Overall dimension

Overall size

494mm*882mm*1668mm

Weight

500Kg

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