Cutter Wheel Cutting Machine
Wheel Cutting Series
This equipment is mainly developed for semiconductor and 3C industries. Suitable for cutting silicon, ceramics, glass, SiC and other materials. It has the advantages of fast cutting speed and high positioning accuracy. The equipment is equipped with a high-precision CCD vision system, which can realize the automatic positioning and angle adjustment of the workpiece and improve the processing efficiency.
Efficient
Small-Size
High-Speed
ask priceProduct Data
Product advantages：
- Small size
The appearance size and the floor area are small, and the cutting stroke is large.
- High efficiency
High power spindle, high-speed and high-precision motor, closed-loop motion control to ensure production efficiency.
- Complete detection
Equipped with NCS, knife mark, edge collapse and cutting path position detection function
- Fullly featured
It is equipped with data management, alarm recording and log management functions.
Applications：
- Semiconductor industry
- 3C industry
Sample display：
Cutting of plyglass; thickness: 2.5mm
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