Cutter Wheel Cutting Machine

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Wheel Cutting Series

Cutter Wheel Cutting Machine

This equipment is mainly developed for semiconductor and 3C industries. Suitable for cutting silicon, ceramics, glass, SiC and other materials. It has the advantages of fast cutting speed and high positioning accuracy. The equipment is equipped with a high-precision CCD vision system, which can realize the automatic positioning and angle adjustment of the workpiece and improve the processing efficiency.
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  • Product Description

Product advantages：

  • Small size

The appearance size and the floor area are small, and the cutting stroke is large.

  • High efficiency

High power spindle, high-speed and high-precision motor, closed-loop motion control to ensure production efficiency.

  • Complete detection

Equipped with NCS, knife mark, edge collapse and cutting path position detection function

  • Fullly featured

It is equipped with data management, alarm recording and log management functions.

Applications：

  • Semiconductor industry
  • 3C industry

Sample display：

Cutting of plyglass; thickness: 2.5mm

laser cutting of plyglas

laser cutter

  • Technical Parameters

Item Main Parameters
Working table size Circular working table Ø6"
X axis Available track 235mm
Cutting stroke 0.1—800mm/s
Y axis Available track 145 mm
Stroke resolution 0.0005mm
Repetitive positioning accuracy 0.001mm
T axis Angle range 335°deg
Repetitive positioning accuracy 0.001°
Function Automatic positioning of workpiece Standard configuration
Automatic alignment of workpiece Standard configuration
NCS height measurement Standard configuration
Overall dimension Overall size 494mm*882mm*1668mm
Weight 500Kg

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