Fully Automated Wafer Marking Equipment

Wafer Marking Series

Fully Automated Wafer Marking Equipment

For the pan semiconductor and 3C industries, it is applied to various types of identification of Si, Gan, SiC, glass and surface coating materials, and is applicable to 8-inch and above wafers.

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  • Product Description

Product advantages:

  • Picosecond light sourceis used, good effect

Picosecond light source is used to mark / code on the material surface, with small thermal impact and good effect

  • Marking / coding support multiple formats

Support various formats: QRcode, dmcode, line text and other formats

  • Support information uploading

Equipped with code reading module to support information uploading to MES system

  • High compatibility and automation

The equipment is compatible with 8-12inch wafers, fully automatic loading and unloading

  • Automatic switch, saving labor

Equipped with load mechanism, which can automatically open / close the wafer cassette

  • Marble base, high stability

Marble base, stable optical path system, thus ensuring high-quality optical transmission

Sample display:

Various wafer marking diagrams

laser marking

  • Technical Parameters

HD S2113 Main parameters
Laser Average output power ≥5W (optional)
Pulse width <10ps
Laser wavelength Lamp Source
Linear motor parameters Motor stroke 450*650mm
CCD positioning system Pixel 12 million pixels, positioning accuracy 0.003mm
Code reading system Pixel 600 million pixels
Machining accuracy Positioning accuracy ≤±0.03mm
Machining dimensional accuracy ≤±0.02mm
Handling robot Number of robot arms Single / double arm
Finger Clamping / adsorption
Others Charging machine Yes
Mapping Yes
Edge finder 8- 12inch is compatible
General indicators Cleanliness level Hundred level 500
Size 1900mm*1800mm*1950mm (main body)
Weight About 2.5t

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