Automotive Industry
Laser Solutions for Automotive Manufacturing | HGLaser


Product advantages:
Picosecond light source is used to mark / code on the material surface, with small thermal impact and good effect
Support various formats: QRcode, dmcode, line text and other formats
Equipped with code reading module to support information uploading to MES system
The equipment is compatible with 8-12inch wafers, fully automatic loading and unloading
Equipped with load mechanism, which can automatically open / close the wafer cassette
Marble base, stable optical path system, thus ensuring high-quality optical transmission
Sample display:
Various wafer marking diagrams

| HD S2113 | Main parameters | |
| Laser | Average output power | ≥5W (optional) |
| Pulse width | <10ps | |
| Laser wavelength | Lamp Source | |
| Linear motor parameters | Motor stroke | 450*650mm |
| CCD positioning system | Pixel | 12 million pixels, positioning accuracy 0.003mm |
| Code reading system | Pixel | 600 million pixels |
| Machining accuracy | Positioning accuracy | ≤±0.03mm |
| Machining dimensional accuracy | ≤±0.02mm | |
| Handling robot | Number of robot arms | Single / double arm |
| Finger | Clamping / adsorption | |
| Others | Charging machine | Yes |
| Mapping | Yes | |
| Edge finder | 8- 12inch is compatible | |
| General indicators | Cleanliness level | Hundred level 500 |
| Size | 1900mm*1800mm*1950mm (main body) | |
| Weight | About 2.5t | |