HGTECH

en
Pico-second Laser Cutting Machine
LK Series
Picosecond laser wire cutting technology is used to cut the whole plate of the mobile phone camera protection glass to replace the traditional CNC processing mode.

Product Data

Picosecond laser cutting machine product description:

● Use the picosecond wire-cutting technology to "cut through" the material directly;  
● Using PSO control for cutting, um-level accuracy, path and control are synchronized to achieve "shaped cutting";  
● Equipped with CCD visual positioning, offset correction compensation, "unlimited correction";  
● Customize the automatic loading and unloading system to meet the ergonomic design, so that the processing is "saving effort and rest assured";  

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