Optical Module

CuW Substrate Automated Assembly System

High-precision integrated system for assembly, dispensing, curing, and inspection in optical-module packaging.

It precisely assembles CuW substrates with COB substrates, TO packages, or chips; applies and cures thermal or epoxy adhesives uniformly,and performs automated post-assembly inspection and sorting.

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  • Product Description

Key Advantages

Replaces manual assembly and addresses low throughput, positioning errors, non-uniform adhesive layers, unstable thermal resistance,
and inconsistent quality.

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