Fully Automated Wafer Laser Annealing Machine
HGTECH LUA3200 Ultra-efficient Fully Automated Wafer Laser Annealing Machine:The EFEM system pre-positions the wafer, a customized laser annealing head and precision motion platform work together to anneal the entire SiC wafer backside metal (Ni or T layer), ensuring good ohmic contact, reduced contact resistance, and improved device performance.