Automotive Industry
Automotive Laser Manufacturing Solutions


Product advantages:
Suitable for 4-8 inch wafers, substrates, epitaxial wafers and patterned wafers
Detect particles, pits, bumps, scratches, stains, cracks and other defects
System resolution: 1-10 μ m
No pattern wafer: 180 seconds / wafer when the number of defects is less than 200
Sample display:
Sample 1

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| Item | Main parameters | |
| General parameters | Wafer size | Standard 4 ", 6" (expandable 4 "- 8") |
| Number of boxes | Double-deck, 14 pcs | |
| Loading and unloading method | Robot, mapping scanning | |
| Motion platform | Y stroke 350mm, repetitive accuracy 10µm Z stroke 8mm, repetitive accuracy 5µm |
|
| Capacity | 4", 140WPH 6", 120WPH | |
| Test accuracy | 7 µm | |
| Detection performance | Camera | High resolution industrial camera |
| Lens | HD industrial lens | |
| Light source | Patented light source | |
| Power supply specification | AC220V, 50Hz | |
| Environment requirement | Air source requirements | 0.5-0.7Mpa compressed air, without obvious water vapor and grease |
| Using environment | Temperature: 15-40 ℃. Humidity requirement: 30% - 70%, no frost | |
| Overall size | 1800mm*1300mm*2250mm | |