Semiconductor Substrate Defect Detection Equipment

Defect Detection Series

Semiconductor Substrate Defect Detection Equipment

Facing the upstream raw material manufacturing enterprises and the midstream wafer manufacturing enterprises in the semiconductor industry chain, the independent developed optical bright and dark field detection system is used to detect the appearance defects of semiconductor raw materials, epitaxial wafers and patterned wafers.

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  • Product Description

Product advantages:

  • Applicable to a variety of wafers

Suitable for 4-8 inch wafers, substrates, epitaxial wafers and patterned wafers

  • Can detect a variety of defects

Detect particles, pits, bumps, scratches, stains, cracks and other defects

  • High resolution

System resolution: 1-10 μ m

  • Fast detection speed

No pattern wafer: 180 seconds / wafer when the number of defects is less than 200

Sample display:

Sample 1

defect detection machine

Sample 2

defect detection machine

Sample 3

defect detection machine

  • Technical Parameters

Item Main parameters
General parameters Wafer size Standard 4 ", 6" (expandable 4 "- 8")
Number of boxes Double-deck, 14 pcs
Loading and unloading method Robot, mapping scanning
Motion platform Y stroke 350mm, repetitive accuracy 10µm
Z stroke 8mm, repetitive accuracy 5µm
Capacity 4", 140WPH 6", 120WPH
Test accuracy 7 µm
Detection performance Camera High resolution industrial camera
Lens HD industrial lens
Light source Patented light source
Power supply specification AC220V, 50Hz
Environment requirement Air source requirements 0.5-0.7Mpa compressed air, without obvious water vapor and grease
Using environment Temperature: 15-40 ℃. Humidity requirement: 30% - 70%, no frost
Overall size 1800mm*1300mm*2250mm

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Main Business
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