Nanosecond Laser Scribing Equipment
Nanosecond laser is used for precise dicing of GPP wafers.

Product Data

Product advantages:

 

  • High processing quality

          The cutting line width is narrow (taking ultraviolet dicing as an example: including HAZ ≤ 30 ± 5 μm) , small edge collapse ≤ 10 μm

 

  • High processing efficiency

          UPH ≥ 15 (take 40mil, 5-inch GPP wafer as an example, including automatic loading and unloading)

 

  • Good processing stability

          Nanosecond laser has high power stability and good beam quality (M ² < 1.5)

 

Sample display:

 

Front positioning, front cutting: 4-inch flat wafer, grain

laser cutting

 

Front positioning, back cutting: 5-inch GPP wafer

laser cutter

Item

Main parameters

Model

LUD3200

LUD3210

Laser

Center wavelength

~355nm

~1064nm

Cutting head

Self-developed

Self-developed

Performance

Effective working stroke

200x300mm(optional)DD motor

200x300mm(optional)DD motor

Repetitive positioning accuracy

±2μm±5arc sec

±2μm±5arc sec

Visual positioning

Front positioning, front cutting

Front positioning, back cutting

Scribe line width

≤30±5μm

40±5μm

Others

Power supply specification

220V/50Hz/3.5kW

220V/50Hz/3.5kW

Overall size

1150mm*800mm*1700mm

1150mm*800mm*1700mm

Weight

1000 Kg

1000 Kg

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