Precision Laser Processing
HGLaser provides advanced micron‑level laser systems for wafer processing, brittle material cutting, high‑reflectivity material precision welding, PCB marking and depanelling, optical coupling, power battery manufacturing, hydrogen electrolyzer manufacturing, and additive manufacturing.
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Ultra-high Welding Precision with Minimal Workpiece Deformation
The laser beam achieves ultra-precise welding with a tiny heat-affected zone. It effectively reduces workpiece deformation, cracks and oxidation, producing smooth, defect-free welds. It is perfectly suited for high-precision thin-wall and electronic parts.
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High Processing Efficiency and Strong Production Adaptability
This machine features fast welding speed and higher production efficiency than traditional equipment. Its flexible non-contact welding adapts to complex workpieces and supports automated line integration. It ensures stable operation and effectively cuts production costs.
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