HGTECH LUA3200 Ultra-efficient Fully Automated Wafer Laser Annealing Machine：The EFEM system pre-positions the wafer, a customized laser annealing head and precision motion platform work together to anneal the entire SiC wafer backside metal (Ni or T layer), ensuring good ohmic contact, reduced contact resistance, and improved device performance. 

Product Advantages

• SEMI certified for the semiconductor industry.
• Equipped with a semiconductor-standard EFEM front-end system.
• Contact resistivity < 10-5 Ω·cm² after annealing.
• Low carbon deposition,non-annealed surface temperature <120°C.Certified by SEMI Semiconductor Industry Standards