LUA3200

Fully Automated Wafer Laser Annealing Machine

HGTECH LUA3200 Ultra-efficient Fully Automated Wafer Laser Annealing Machine:The EFEM system pre-positions the wafer, a customized laser annealing head and precision motion platform work together to anneal the entire SiC wafer backside metal (Ni or T layer), ensuring good ohmic contact, reduced contact resistance, and improved device performance.

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  • Product Description

HGTECH LUA3200 Ultra-efficient Fully Automated Wafer Laser Annealing Machine:The EFEM system pre-positions the wafer, a customized laser annealing head and precision motion platform work together to anneal the entire SiC wafer backside metal (Ni or T layer), ensuring good ohmic contact, reduced contact resistance, and improved device performance.

Product Advantages

  • SEMI certified for the semiconductor industry.
  • Equipped with a semiconductor-standard EFEM front-end system.
  • Contact resistivity < 10-5 Ω·cm² after annealing.
  • Low carbon deposition,non-annealed surface temperature <120°C.Certified by SEMI Semiconductor Industry Standards

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