Picosecond Laser Scribing Equipment

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Laser Scribing Series

Picosecond Laser Scribing Equipment

Ultra violet picosecond laser is used for precision half cutting or full cutting of silicon and compound semiconductor wafers.
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  • Product Description

Product advantages：

  • High quality

Cutting line width is narrow (taking ultraviolet collimation as an example, cutting line width + HAZ ≤ 20 ± 5 μ m) Small edge collapse (≤ 10 μ m）

  • High efficiency

UPH ≥ 10 (UV galvanometer: take 3-inch double mesa silicon diode wafer as an example, including automatic alignment time)

  • Good stability

The laser has high pulse stability (≤ 2% RMS) and high beam quality (M ² ≤1.2)

Sample display：

Cutting front - 3-inch double mesa diode wafer laser full cutting; Grain size: 300 * 300 μm, Wafer thickness 130 μm, Cutting channel thickness 30 μm.

laser cutter

Cutting back - 3-inch double mesa diode wafer laser full cutting; Grain size: 300 * 300 μm, Wafer thickness 130 μm, Cutting channel thickness 30 μm.

laser cutter

  • Technical Parameters

Item Main parameters
  Model LUD3200 LUD3210
Laser Center wavelength ~355nm ~355nm
Cutting head Laser scanning head Laser collimator
Performance Effective working stroke 200x300mm(optional)、DD motor 200x300mm(optional)、DD motor
Repetitive positioning accuracy ±2µm、±5arc sec ±2µm、±5arc sec
Visual positioning Front positioning, front cutting Front positioning, front cutting
Scribe line width ≤30±5µm ≤20±5µm
Others Power supply specification 220V/50Hz/3.5kW 220V/50Hz/3.5kW
Overall size 1500mm*1700mm*2000mm 1500mm*1700mm*2000mm
Weight 1500 Kg 1500 Kg

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