Wafer Laser Marking Equipment
Facing the semiconductor industry, the wafer manipulator and external coaxial vision positioning technology are adopted to realize the full-automatic laser marking of 2-6 inch wafers.

Product Data

Product advantages:

  • High automation

          Special robot for wafer automatic picking and placing, automatic focusing

  • Strong compatibility

          With different light sources, it can adapt to different accuracy levels

  • High fault tolerance

          Intelligent, visual positioning + automatic edge finding, high fault tolerance

 

Sample display:

Sample 1

laser marking

 

Sample 2

laser marking

 

Sample 3

laser marking

 

Sample 4

laser marking

 

Sample 5

laser marking

Item

Main parameters

Laser

Model

LSF20

LSU5EB

Laser light source

Fiber laser

UV laser

Laser wavelength

1064nm

355nm

Average power

20W

5W

Performance

Machining accuracy

±0.1mm

±0.05mm

Max width

150×150mm

150×150mm

Support document format

bmp,jpg,png,ai,dxf,dst,plt

Others

Power supply specification

2.0KW/AC220V/50HZ

Temperature

0-40℃

<35℃

Overall size(length×width×height)

1250mm*900mm*1900mm

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