Wafer Laser Marking Equipment for Semiconductors

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Wafer Marking Series

Wafer Laser Marking Equipment for Semiconductors

Facing the semiconductor industry, the wafer manipulator and external coaxial vision positioning technology are adopted to realize the full-automatic laser marking of 2-6 inch wafers.
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  • Product Description

Product advantages:

  • High automation

Special robot for wafer automatic picking and placing, automatic focusing

  • Strong compatibility

With different light sources, it can adapt to different accuracy levels

  • High fault tolerance

Intelligent, visual positioning + automatic edge finding, high fault tolerance

Sample display:

Sample 1

laser marking

Sample 2

laser marking

Sample 3

laser marking

Sample 4

laser marking

Sample 5

laser marking

  • Technical Parameters

Item Main parameters
Laser Model LSF20 LSU5EB
Laser light source Fiber laser UV laser
Laser wavelength 1064nm 355nm
Average power 20W 5W
Performance Machining accuracy ±0.1mm ±0.05mm
Max width 150×150mm 150×150mm
Support document format bmp,jpg,png,ai,dxf,dst,plt
Others Power supply specification 2.0KW/AC220V/50HZ
Temperature 0-40℃ <35℃
Overall size (length×width×height) 1250mm*900mm*1900mm

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