The Fully Automatic SiC Wafer Modification and Cutting Equipment LUSD3310 uses multiple high-precision CCD vision cameras to automatically identify and locate 6-8 inch wafers with various die specifications. Combining custom ultrafast lasers with a precision motion platform for relative movement, it performs internal wafer modification (stealth dicing). A dedicated wafer splitter then completes full wafer dicing and die separation.

• The system features a self-developed dynamic focus compensation module combined with a high-precision air-bearing linear motion platform, achieving industry-leading quality in high-precision, high-consistency wafer processing.
   
• Equipped with a standard-design black-box enclosed optical path for stealth dicing, it ensures stable laser beam transmission and energy output, providing excellent processing stability.

• With proprietary cutting and vision software, the system offers highly customizable functional modules to meet specific industry needs.

Product Advantages

• Certified by SEMI Semiconductor Industry Standards

• Customizable vision and cutting software modules adaptable to various wafer types

• Equipped with SEMI-standard automated wafer handling and inspection systems

• Integrated with high-precision Dynamic Focus Compensation System (DFT) and Autofocus System

• Achieves processing precision of ≤ ±3 microns, meeting advanced industry benchmarks

• Supports 6-8 inch wafers with dynamic focus compensation, autofocus, and auto-alignment to meet diverse processing needs