English
VR
Home / Products / Automated Production Lines / Optical Semiconductor

LUSD3310

Fully Automatic SiC Wafer Modification and Cutting Equipment

The Fully Automatic SiC Wafer Modification and Cutting Equipment LUSD3310 uses multiple high-precision CCD vision cameras to automatically identify and locate 6-8 inch wafers with various die specifications. Combining custom ultrafast lasers with a precision motion platform for relative movement, it performs internal wafer modification (stealth dicing). A dedicated wafer splitter then completes full wafer dicing and die separation.
Online booking Documents

Product Consultation

Name *
Company name *
E-mail *
Phone *
Country *
Main Business

  • Product Description

The Fully Automatic SiC Wafer Modification and Cutting Equipment LUSD3310 uses multiple high-precision CCD vision cameras to automatically identify and locate 6-8 inch wafers with various die specifications. Combining custom ultrafast lasers with a precision motion platform for relative movement, it performs internal wafer modification (stealth dicing). A dedicated wafer splitter then completes full wafer dicing and die separation.

  • The system features a self-developed dynamic focus compensation module combined with a high-precision air-bearing linear motion platform, achieving industry-leading quality in high-precision, high-consistency wafer processing.
  • Equipped with a standard-design black-box enclosed optical path for stealth dicing, it ensures stable laser beam transmission and energy output, providing excellent processing stability.
  • With proprietary cutting and vision software, the system offers highly customizable functional modules to meet specific industry needs.

Product Advantages

  • Certified by SEMI Semiconductor Industry Standards

  • Customizable vision and cutting software modules adaptable to various wafer types

  • Equipped with SEMI-standard automated wafer handling and inspection systems

  • Integrated with high-precision Dynamic Focus Compensation System (DFT) and Autofocus System

  • Achieves processing precision of ≤ ±3 microns, meeting advanced industry benchmarks

  • Supports 6-8 inch wafers with dynamic focus compensation, autofocus, and auto-alignment to meet diverse processing needs

Samples

Message Form

Name *
Company name *
Country *
Main Business
E-mail *
Phone *
Specific Requirements *