Automobile Industry
Automotive Laser Manufacturing
































































































































































HGTECH provides PCB and microelectronics laser solutions covering PCBA depaneling, PCB/FPC marking, FPC drilling, FPC cover film cutting, ceramic substrate cutting, IC substrate X-Out marking, IC package marking, inspection support, automation integration, and traceability management.
· Full-automatic IC Packaging and Laser Marking Series
· IC Substrate X-Out Laser Marking Series
· SMT Double Head PCB Laser Marking Series