HGTECH 武汉华工激光工程责任有限公司
Copyright HGLaser Engineering Co,.Ltd. All Rights Reserver.
News
Home > News > Company News
3C Intelligent Manufacturing in Full Swing: HGTECH Showcases at productronica 2025
2025-11-21580
On November 18, productronica 2025 opened in Munich, Germany. HGTECH presented a comprehensive lineup of solutions for the PCB and micro-electronics sector, highlighting the company‘s technological strength in electronics manufacturing.
productronica 2025
As one of the world’s top exhibitions for electronics production equipment, productronica has been held biennially since 1975. With its strong professionalism and broad scope, the show covers the entire value chain of electronic component manufacturing.
Focusing on cutting-edge applications in electronics manufacturing, HGTECH showcased its full-process “Laser + Packaging + Inspection” solution for PCB/substrate applications, and engaged with visitors on laser technologies for 3C electronics, semiconductors, and hard-brittle materials.
Intelligent Thick-Plate Laser Cutting Equipment
Fully Automatic Micro-Cutting Workstation
High-Speed Line-Scan Laser Depaneling Equipment
HGTECH has now built a complete SMT/IC substrate intelligent manufacturing solution integrating Laser + Packaging + Inspection, covering laser marking, depaneling, sorting, and intelligent inspection. These technologies are widely used in high-end chip manufacturing such as communication and memory chips, 5G RF chips, and CPU processors.
SMT/IC Substrate
Laser + Packaging + Inspection
Integrated Intelligent Manufacturing Solution
In the fields of 3C electronics, PCB micro-electronics, and semiconductors, HGTECH has developed a series of “global-first, industry-leading, and specialized high-tech” products based on deep technical expertise and close alignment with the global electronics industry.
In the 3C sector, HGTECH provides comprehensive laser processing solutions—from hard-brittle materials to internal structural components of smartphones.
In the PCB industry, HGTECH accelerates the shift toward high density and miniaturization.
In the semiconductor sector, HGTECH has successfully developed key equipment including wafer laser cutting and laser annealing, aiming to overcome core technical barriers and gradually build a full-chain laser intelligent manufacturing system for electronics production.
Hard-Brittle Materials
Integrated Intelligent Manufacturing Solution
3C Industry
Integrated Intelligent Manufacturing Solution
Going forward, HGTECH will continue to explore overseas 3C electronics markets, strengthen its presence around global electronics manufacturing hubs, and track emerging needs in AI-driven production and flexible manufacturing across Europe and worldwide. Through continuous technological innovation and refined market strategies, HGTECH will further demonstrate its innovation capabilities to international customers.
Ask for the price?
