Product advantages:

• High quality

          Use ultra short pulse processing to reduce edge collapse, delamination and thermal impact, and adopt high-precision visual positioning to ensure the slotting position

• High efficiency

          Based on spatial light modulation technology, the size and shape of the shaping spot can be adjusted, and the laser energy utilization rate is high and the response is fast

• High integration

          Integrated protective liquid coating, wafer slotting and cleaning module

Sample display:

Low-k wafer slotting, depth > 10 μm， Width: 40 μm.