Automobile Industry
Automotive Laser Manufacturing


Product advantages:
Use ultra short pulse processing to reduce edge collapse, delamination and thermal impact, and adopt high-precision visual positioning to ensure the slotting position
Based on spatial light modulation technology, the size and shape of the shaping spot can be adjusted, and the laser energy utilization rate is high and the response is fast
Integrated protective liquid coating, wafer slotting and cleaning module
Sample display:
Low-k wafer slotting, depth > 10 μm, Width: 40 μm.



| Item | Main parametetrs | |
| Laser | Center wavelength | ~532nm |
| Cutting head | Spatial light shaping module | |
| Performance | Effective working stroke | 300x400mm(optional) |
| Repetitive positioning accuracy | ±1µm | |
| Visual positioning | Automatic visual positioning | |
| Slot depth | ≥10µm | |
| Others | Wafer size | 8 inch (12inch is compatible ) |
| Processing process | Protective liquid coating - wafer grooving - cleaning | |
| Processing object | Low - K wafers, silicon-based Gan, etc | |