Wafer Slotting Series

Wafer Laser Slotting Equipment

This equipment is designed for 8-inch and above chip sealing and testing plants, and is applied to low-k wafers and silicon-based Gan wafers with 40nm and below in the semiconductor industry.

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  • Product Description

Product advantages:

  • High quality

Use ultra short pulse processing to reduce edge collapse, delamination and thermal impact, and adopt high-precision visual positioning to ensure the slotting position

  • High efficiency

Based on spatial light modulation technology, the size and shape of the shaping spot can be adjusted, and the laser energy utilization rate is high and the response is fast

  • High integration

Integrated protective liquid coating, wafer slotting and cleaning module

Sample display:

Low-k wafer slotting, depth > 10 μm, Width: 40 μm.

laser cutter

laser cutter

laser cutter

  • Technical Parameters

Item Main parametetrs
Laser Center wavelength ~532nm
Cutting head Spatial light shaping module
Performance Effective working stroke 300x400mm(optional)
Repetitive positioning accuracy ±1µm
Visual positioning Automatic visual positioning
Slot depth ≥10µm
Others Wafer size 8 inch (12inch is compatible )
Processing process Protective liquid coating - wafer grooving - cleaning
Processing object Low - K wafers, silicon-based Gan, etc

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