LSU Series

UV Laser Marking Machine

With small UV focus spot and heat affected zone, UV laser marking machine has high absorptivity to 355nm UV-light, which is suitable for many materials. 

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Product Features

  • Minimal Heat-Affected Zone

    With an extremely small UV focus spot, the heat-affected zone is negligible, enabling cold processing of heat-sensitive materials.
  • High Absorptivity on Diverse Materials

    UV wavelength (355nm) is readily absorbed by most materials including glass, ceramics, polymers, and semiconductor substrates, ensuring clean marking results.
  • Non-Contact, Non-Destructive Processing

    Laser-based marking eliminates mechanical stress, making it ideal for fragile or delicate components.
  • Wide Application Range

    Suitable for PCB, flexible circuits, glass, sapphire, ceramics, pharmaceuticals, cosmetics packaging, and high-end electronic components.
  • Product Description

With small UV focus spot and heat affected zone, UV laser marking machine has high absorptivity to 355nm UV-light, which is suitable for many materials.

● High-performance ultraviolet laser and superior laser beam quality bring exquisite marking effect for customers;
● The rotary table shortens unit processing time. Customer benefits grow exponentially at the same time;
● Equipped with safety hood, it avoids physical injury of operators by misoperation and minimizes the safety risk;
● Small size and good cooling performance.

It’s widely used in special materials marking, cutting and processing, such as all kinds of glass, LCD panel, textiles, chip ceramics, semiconductor wafers, IC grains, sapphires, polymer films, etc.

  • Technical Parameters

Equipment model LSU3EA LSU5EA
Nominal average output power 3W 5W
Laser Wavelength 355nm
Pulse repetition frequency 20~200kHz
Average power stability <3%rms
Marking range (Optional) F170/105×105 (Standard), F120/140×140, F255/170×170
Minimum mark line width 0.01mm(Depends on the material)
Minimum character height 0.03mm
Repeat positioning accuracy <24 μrad(F170, 4.1 μm)
Long time drift <0.6 mrad, Constant ambient temperature +15 ℃~+35 ℃, 8 hours of continuous work)
Scan speed F=170mm, 7000mm/s
Cooling method Water cooling
System power supply 1.5KW/AC220V/50Hz
Total Weight ≈255Kg
Operating environment requirements 10 ~ 35 ℃, humidity ≤90%
Complete sets of equipment dimensions 1052mm×640mm×1715mm (Length × Width × Height)

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