

HGlaser High-Precision High-Speed Die Bonding / Eutectic Intelligent Equipment is suitable for high-precision semiconductor packaging in fields including 5G anSuitable for high-precision semiconductor packaging in fields including 5G and data communications, lasers high-precision MEMS, medical and biological optics, automotive LEDs, optics, power semiconductors, RF.microwave and antennas, sensors, and telecommunications, Through ultra-high-precision motion control and inteligent process systems, the equipment specifically addresses yield, efficiency and reliability issues in high-precision chip die bonding, meeting eutectic and die bonding process reguirements from single chips to complex optoelectronic devices, achieving domestic substitution of imported equipment.
/ Bonding Accuracy: ±1.5 μm
/Angle Accuracy: ±0.1-0.3°
/Process: Die bonding/Eutectic
Typical Application+Product Features
/ Ultra-high precision: Die bonding accuracy ± 1.5 u m, bonding angle controlaccuracy ± 0.1-0.3°,ensuring product bonding accuracy and final yield.
/ High-efficiencyoutput: Integrated multi-nozzle automatic replacement, dynamic tool changing, dual intermediate rotation axes and efficienteutectic process.
/ Wide application range: Covers 5G/data comm, lasers, MEMS, medical optics, automotive LEDs, power semiconductors, RF/microwave, sensors, telecom.
/ Domestic substitution: Replaces imported equipment for high-precision chip packaging.