From March 18 to 20, 2026, the Laser World of Photonics Shanghai came to a grand conclusion at the Shanghai New International Expo Centre. As one of the most influential industry events in the Asia-Pacific optoelectronics sector, this exhibition gathered nearly 1,500 exhibitors from 22 countries and regions, covering an exhibition area of over 100,000㎡. The event saw a continuous flow of professional visitors, showcasing the booming momentum of the optoelectronics industry.

As a core company that has never missed an exhibition since its first participation, HGTECH made an impressive appearance at booth N1-1412 with an expanded display. The site was bustling with visitors, drawing attention as the focal point of the event. With cutting-edge exhibits and full-stack solutions, HGTECH fully showcased its leadership strength in the industry. The booth covered 350㎡, marking an unprecedented scale and further demonstrating HGTECH's strong capabilities and influence as an industry leader.

This year, HGTECH focused on "AI + Laser" full-stack solutions, presenting powerful achievements such as SiC wafer modification and cutting intelligent equipment, high-speed, high-precision hybrid laser processing equipment, and the HGTECH VisionForge Digital Twin System. These products cover core fields such as semiconductors, clean energy, heavy industry, and 3C, comprehensively showcasing the full-link capabilities from technical units, intelligent equipment, automated production lines, to industrial intelligence systems. Through this showcase, HGTECH not only demonstrated its deep accumulation of technological innovation but also fully highlighted its leading role in driving smart manufacturing and industry transformation.

AI + Intelligent Equipment

SiC Wafer Modification and Cutting Intelligent Equipment

This latest equipment, equipped with the Dicing Agent AI system, adopts infrared laser non-contact slicing technology. It focuses the laser inside the wafer to form a precise modified crack layer, guiding the wafer to separate along the pre-set path. This process eliminates tool wear and front-side damage, significantly improving the yield and mass production efficiency of SiC chips.

·  Non-contact Processing: Internal focus precision modification creates directional cracks, with zero tool wear and thermal impact. 

·  AI Algorithm: Equipped with the Dicing Agent AI system for precise edge detection, automatic focusing, auto-tooling, and alarm suppression. Single alarm suppression time is just 1 second, enhancing the human-machine ratio to 1:20. 

·  Autonomous Control: Full autonomous control of lasers, motion platforms, and software ensures long-term stable supply. 

·  Industry Certification: Certified by SEMI Semiconductor Industry, meeting automotive-grade chip standards.

High-Speed, High-Precision Hybrid Laser Processing Intelligent Equipment

This equipment covers laser cutting, welding, and 3D printing technologies, integrating AI to empower laser processing.

·  Full-Stack Intelligent Ecosystem: The core of the system is AI vision algorithms, granting equipment autonomous perception and decision-making abilities. It integrates a large model expert system, closing the loop from intelligent operation, process self-learning, to AI programming. 

·  High-Stability Design Platform: The platform uses an integrated ultra-static bed with superior damping properties, effectively suppressing vibration. It also features an integrated electrical cabinet and thermal control system to ensure thermal stability under all working conditions. 

·  High-Speed, High-Precision CNC System: The equipment is equipped with the self-developed Farly-ONE control system, combined with linear motor drives and absolute scale encoders for full closed-loop feedback, achieving high-speed and high-precision motion control. 

·  Multi-source Sensing and Intelligent Monitoring: Equipped with a multi-dimensional sensing system for sound, vibration, and temperature, it performs intelligent diagnostics and closed-loop management, precisely locating and alerting potential faults. 

·  Multi-functional Hybrid Laser Processing: By swapping laser heads, the software interface allows users to seamlessly switch between five-axis laser cutting, welding, and 3D printing tasks for complex shapes and surfaces. 

·  Customized Automated Production Lines: Tailored for industries like new energy vehicles, aerospace, and precision manufacturing, the automated lines support loading, precision processing, and inspection integration.

AI + Digital Twin

The HGTECH·MirrorForge Digital Twin System enables the digital mapping of all elements and processes in manufacturing. It offers simulation, monitoring, diagnostics, forecasting, and optimization capabilities, facilitating rapid verification of production line planning and optimizing production efficiency and resource utilization. It deeply integrates digital twin and VR technology, expanding immersive equipment inspections and virtual training scenarios to improve inspection efficiency and reduce training costs and risks.

AI + Industrial Intelligence Systems

The HGTECH·VisionForge Smart Assembly and Interactive Puzzle Workstation integrates machine vision and intelligent control technologies to create a smart production line with virtual and physical interaction.

System Capabilities: It can achieve high-precision target recognition and flexible assembly in complex environments, with part adaptive picking and intelligent trajectory planning. 

Human-Machine Collaboration: The system fosters creative scenarios such as puzzle-solving and virtual assembly, enriching industrial automation with intelligence and fun.

Exhibition Highlights

During the exhibition, the booth hosted a continuous stream of industry chain customers and partners, with live demonstrations, technical exchanges, and business negotiations happening non-stop. Multiple cutting-edge technical presentations were held, deeply aligning with industry trends, process pain points, and key technologies. The audience was able to gain valuable insights through real-world case studies and product selection references, enhancing their understanding and application skills.

In total, eight high-density professional presentations were held over two days. The content covered intelligent solutions and precise answers to questions, expanding the industry's vision and reinforcing the application capabilities of the attendees.

Looking to the Future

HGTECH will continue to deepen its focus on core technologies in laser manufacturing, consistently producing high-quality content and customized solutions. Together with global industry partners, HGTECH is committed to advancing industry upgrades and achieving efficient progression.