As AI computing power enters an era of explosive growth, AI servers have become the core engine of digital infrastructure. The two key pillars that determine computing power limits, signal quality, and transmission efficiency are the high-precision printed circuit boards (PCBs) and high-speed connectors.

From the micrometer-level drilling of high-layer HDI boards to the high-precision molding and intelligent inspection of high-speed connectors, laser technology is comprehensively reshaping the manufacturing boundaries of core components for AI servers.

HGTECH presents a wealth of industry solutions centered around AI applications, showcasing its up-to-date R&D innovation capabilities.

1. AI Computing Power Era

Packaging Substrate Micro-Hole Intelligent Manufacturing Solution

HGTECH Packaging and Testing Industry Solutions

Focusing on the drilling process challenges under the AI computing power demand, HGTECH introduces two intelligent equipment models:

Laser Substrate Punching Intelligent Equipment

This equipment is developed for high-speed punching of copper-clad boards. It adopts optical DOE spot homogenization technology, offering advantages over traditional mechanical drilling methods, such as faster speed, the ability to drill small holes, and easy mold change. It is suitable for processing various blind holes, through-holes, and grooves.

Advantages:

• Optimized Design: Dual-laser head and dual-adsorption platform design enhance efficiency and save space. 
•  Automatic Loading and Unloading: Equipped with automatic loading and unloading machines, reducing manual intervention time. 
• Good Stability: Uses digital galvanometer and telecentric lens, high spatial precision linear motors, ensuring high accuracy, and stable performance. 
• High-Quality Optical Transmission: Uses a marble base, making the optical system stable to ensure high-quality optical transmission. 
• Small Heat-Affected Zone: The optical DOE spot homogenization technology ensures uniform energy distribution, minimizing the heat-affected zone. 
• Strong Compatibility: The equipment is highly compatible and can handle various hole diameters and groove products.

Semi-Automatic Laser-Induced Micro-Hole Equipment

This equipment is developed for high-speed punching of glass. It uses AOD platform linkage technology, which offers faster processing speed and higher efficiency than traditional glass modification induction etching equipment.

Advantages:

• Small Focus Spot and Large Depth of Focus: Uses Bezier cutting head with small focusing spots and large depth of focus. 
• Good Stability and High Precision: High spatial precision linear motors with high orthogonality ensure stable and precise operation. 
• Stable Optical System: Marble base ensures stable optical transmission. 
• High-Speed and High-Efficiency: AOD platform linkage control reduces platform idle time, speeding up the process.

2. High-Speed Connectors
Full-Stack Laser + AI Solutions
Focusing on upgrading the entire electronic manufacturing industry chain, HGTECH presents a full-stack laser + AI integrated solution for high-speed connectors, core components of AI servers and high-speed interconnects.

HGTECH AI High-Speed Connector Industry Laser Solutions

Green Laser Welding Intelligent Equipment

This integrated welding equipment is developed for high-reflective materials such as copper, aluminum, and gold. It integrates green lasers, high-speed galvanometers, high-transmission lenses, CCD vision positioning systems, electric XYZ axes, and temperature-controlled cooling systems, catering to welding needs in multiple fields such as new energy, consumer electronics, and automotive. The AI model integrated into the system allows for millisecond-level monitoring of welding quality and automatic adjustment of the optical path and parameters. It also supports MES systems, enabling 24-hour stable operation, significantly improving production yield and consistency.

Advantages:

• Adaptability to High-Reflective Materials: The 532nm green laser wavelength has a 40% absorption rate for copper, 30% for gold, and a 3x improvement in aluminum, effectively addressing challenges such as spattering and wide heat-affected zones. 
• Excellent Welding Quality: High beam quality ensures stable welding, small heat-affected zones, and weld joint strength up to 90% of the base material, effectively improving defects such as pores and cracks. 
• AI Intelligent Management: Integrated with an AI large model and CCD vision positioning, the equipment can real-time monitor welding data and fine-tune in milliseconds. The 50-group waveform library and parameter optimization algorithms ensure a welding yield of over 95%, reducing manual intervention. 
• Efficient and Stable Operation: The equipment supports continuous welding speeds of 120-150mm/s, improving efficiency by 30%-50%. Power stability is ≤ ±1.5%, and the equipment supports 24-hour continuous operation. Its modular design is compatible with automation production lines, and core components last over 10,000 hours, extending maintenance cycles by 40%.

Nanosecond Laser Welding Intelligent Equipment

This equipment integrates nanosecond pulsed laser technology with incoming material state detection, automatic laser power detection, and LWO welding quality real-time monitoring for stable and reliable welding solutions in high-end manufacturing. It is suitable for small and thin precision components in AI servers, 3C consumer electronics, and precision electronic parts.

Advantages:

• AI Intelligent Control: Built-in AI large models enable autonomous learning and parameter optimization, ensuring high precision and yield. 
• Multi-Material Welding: Can weld copper, aluminum, stainless steel, and other similar and dissimilar materials, covering diverse manufacturing needs. 
• Stable and Easy Management: The unified software interface includes automatic focusing, visual one-click calibration, real-time production status monitoring, and data management for full control.

High-Speed Laser Wire Stripping Intelligent Equipment

Designed for the non-contact wire stripping needs of high-speed connectors, this equipment supports CO2, UV, and fiber lasers and processes various insulating materials, from common PVC and TPU to high-demand materials such as polyimide and Teflon. It produces clean, damage-free cuts without tool wear or mechanical stress, improving processing efficiency by 50%.

Advantages:

• Non-Damaging Processing: Non-contact laser processing prevents damage from extrusion or cutting forces. 
• High-Efficiency Stripping: Dual laser design and high-speed galvanometer system improve efficiency, ensuring clean and residue-free wire stripping. 
• High Flexibility: Compact structure design makes it suitable for production line layout and automation integration. 
• Wide Application: Widely used for stripping of high-speed wire bundles, insulation, copper foil, and silver-plated layers, with batch applications in the high-speed connector industry.

Sample Display

Arrive Intelligence

HGTECH has strategically positioned itself along the dual tracks of "PCB core components + high-speed connectors," offering a comprehensive manufacturing capability from equipment to integrated solutions for the AI server supply chain.

Moving forward, HGTECH will continue to focus on autonomous innovation, closely aligning with AI industry trends, exploring the blue ocean of laser manufacturing applications, and providing solid manufacturing support for computing power.