The consumer electronics industry is advancing toward rapid iteration and high-precision integration. Smartphone manufacturing has entered the era of micron-level precision, and laser technology has become the key driving force behind this transformation. HGTECH, with its outstanding technology, is empowering the intelligent manufacturing upgrade of the consumer electronics industry.

Laser Marking

HGTECH’s laser marking technology is ideal for marking smartphone brand logos, specifications, battery information, and more. With a non-contact, non-destructive process, it meets both aesthetic and information-marking requirements, resists chemical corrosion and high temperatures, and delivers long-lasting, stable results.

Laser Cutting

HGTECH offers a comprehensive range of laser cutting solutions for high-precision applications such as smartphone cover glass and camera modules. Using picosecond filament-forming cutting technology, it achieves “one-pass cutting.” Dual-beam synchronous processing and patented water-cooling technology significantly increase cutting efficiency and reduce production costs.

Laser Welding

HGTECH’s laser welding technology uses micron-sized weld spots to achieve high-strength connections. With an extremely small heat-affected zone, it prevents component deformation, fits the compact internal design of smartphones, and meets the welding requirements of dissimilar materials.

As laser technology continues to advance, HGTECH is accelerating its global expansion, driving the consumer electronics industry toward a more intelligent and precise future.

On September 10, the 17th NEPCON Vietnam 2025 grandly opened at the Hanoi International Center for Exhibition.

NEPCON Vietnam is a professional exhibition that integrates electronics manufacturing SMT, testing technology, equipment, and supporting industries. It aims to become one of the most influential and representative events in the electronics field, bringing the latest technologies and solutions to the electronics manufacturing industry in Vietnam and Southeast Asia.

HGTECH is showcasing two intelligent equipment solutions, focusing on 3C electronics and PCB applications. The company demonstrates to the Southeast Asian market its advanced intelligent equipment, automated production lines, and smart factory capabilities, further deepening its global strategy.

01 SMT Laser Depaneling Equipment

Available in both offline and inline configurations, this equipment uses a high-precision control system and industrial vision system to achieve fully automated laser cutting. It meets the high-precision cutting requirements of PCB assembly companies while ensuring no dust and no deformation.

· Excellent beam quality ensures high cutting quality
· Marble-based optical path system and work platform
· Excellent processing flatness
· Professional cutting vision control system
· Compact equipment structure
· Easy to integrate into various PCBA production lines

02 Smart Equipment for Selective PVD Removal on Smartphone Mid-frames

Used for selective laser removal of PVD coatings on smartphone mid-frames.

It adopts 5-axis positioning for flexible processing to meet personalized product design requirements, and uses a 10W ultraviolet light source compatible with mid-frames of different colors.

This exhibition provides an excellent platform for HGTECH to showcase its strength and vision in intelligent manufacturing. It offers the opportunity to further advance its global expansion, engage in in-depth exchanges with industry leaders and technical experts in Southeast Asia, and work together to explore new possibilities.

Looking ahead, laser technology will continue to drive innovation in the consumer electronics industry, enabling breakthroughs in smart device design, empowering more precise intelligent manufacturing, enhancing product performance, and optimizing the human-machine interaction experience.