A probe card is a critical consumable in the front-end process of semiconductor chip manufacturing. It establishes an electrical connection by contacting the surface of the wafer or silicon chip through test probes, enabling the detection of dies on the wafer. Since different chips require customized probe cards, the demand for probe cards is expected to surge exponentially with the rapid growth of the semiconductor testing market.

The requirements for precision and stability in probe cards are extremely stringent. To address the industry's pain points of high equipment investment costs and difficult maintenance, HGTECH has independently developed intelligent equipment for wafer probe card testing, creating a unique competitive edge.

Focusing on two core materials—substrate and chip —HGTECH leverages its deep technical expertise and comprehensive process solutions to build a full-process technology ecosystem. This includes:

1. Micron-level laser cutting platform 
2. High-precision control unit 
3. Patented low-temperature welding technology 
4. Advanced software system 
5. AI-based deep learning algorithm
6. Fully automated testing technology
7. Adaptive auto-focusing technology 
8. AOI inspection technology 

These technology modules and industry solutions have reached an internationally leading level in terms of performance, functionality, and reliability.

Intelligent Equipment for Wafer Test Probe Card

This intelligent equipment is specifically designed for the precision manufacturing of wafer test probe cards. It covers the entire production process, including probe cutting, probe insertion fixtures, probe welding, and probe card testing. By overcoming the industry's pain points of high precision, high efficiency, and high stability in probe card manufacturing, it significantly lowers the operation threshold, providing customers with a more efficient, high-quality, and intelligent production experience.

1. Micron-Level Precision
2. High-precision cutting: Cutting accuracy of 10μm
3. Accurate alignment: X&Y coordinate offset <4μm, height deviation <8μm
4. High Efficiency Throughout the Process
5. UPH: 0.5s/pin
6. Complete process from incoming material inspection to post-cutting inspection within 1 hour and 20 minutes
7. Ultra-Stable Operation
8. Large-area 3D worktable (300mm*300mm) with a flatness of <25μm

In the future, HGTECH will continue to focus on key industry challenges, developing a series of core intelligent equipment with independent intellectual property rights . By enhancing semiconductor manufacturing efficiency and optimizing costs, HGTECH aims to help customers build a more competitive production system and collaborate with industry partners to establish a secure and controllable semiconductor industry ecosystem .