HGTECH

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Efficiency and Precision Upgraded | HGTECH at Korea Electronics Show 2025
2025-10-27506

 

SEOUL, Korea — October 21–24, 2025 —

 

At the Korea Electronics Show 2025 (KES 2025), held at the COEX Convention & Exhibition Center in Seoul, HGTECH showcased its latest laser intelligent manufacturing systems and industry-focused solutions for the PCB microelectronics, 3C electronics, and semiconductor industries.

 

The Korea Electronics Show (KES) is Korea's largest and most representative exhibition for the electronics and IT industry, recognized as a benchmark event in the global electronics field.

 

Each year, leading international electronics companies gather here to unveil cutting-edge technologies and highlight next-generation innovations shaping the industry's future.

 

 

Keeping pace with emerging trends in PCB and semiconductor manufacturing and responding to global market demand, HGTECH presented its long-selling, high-reliability products that precisely meet the technological needs of the electronics industry.

 

Through direct engagement with global clients, HGTECH explored innovative applications and cooperation opportunities across the international electronics supply chain.

 

 SMT Laser Depaneling Equipment 

 

Designed for PCBA production lines, this system supports both offline and inline operation modes.

It achieves fully automated, high-precision laser cutting through a high-accuracy motion control system and an industrial vision system.  

 

Advantages:

High cutting precision, superior quality, and strong stability;

Supports offline / inline operation modes;

Professional vision-based cutting control system; Compact design with a small footprint.  

 

 

UV Laser Marking Equipment

 

 

This system enables precision marking on materials such as plastics (ABS, PC, PVC, HIPS, etc.), leather, metal, glass, LCD panels, thin ceramics, monocrystalline silicon wafers, IC chips, and sapphire.  

 

It is widely applied in 3C electronics, automotive, electrical instruments, home appliances, and integrated circuits—supporting metal or non-metal coating removal, scribing, and blind groove processing.  

 

Advantages:

Built-in temperature protection and alarm system with real-time power monitoring

Intracavity frequency-doubling and TEC cooling technologies for high-quality, high-speed marking

Integrated and compact cabinet design

 

 

With years of expertise in 3C electronics, PCB microelectronics, and semiconductors, HGTECH has developed a lineup of globally pioneering, industry-leading, and highly specialized products, attracting deep cooperation with customers across the global supply chain.

 

Moving forward, HGTECH will continue to advance its localization strategy, enhance product and technology responsiveness to market demand, and actively participate in high-level global competition and collaboration within the electronics industry.

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